Driven by technology, backed by experience, focused on manufacturing excellence

Incoming Material Inspection

Only through rigorous selection of core materials can we establish and secure our quality standards at the source

Material Preparation

Accurate matching and systematic sorting of materials guarantee high production efficiency and batch-to-batch consistency

Die Bonding

Micron-level high-precision die bonding lays a solid foundation for the stable and reliable performance of the light source

Wire Bonding

High-precision wire bonding technology achieves stable and reliable electrical interconnection between the LED chip and the lead frame/substrate

Dam

High-precision dam forming creates a regular and stable boundary barrier for phosphor glue encapsulation

Baking / Desiccation

Precision temperature-controlled baking and dehumidification eliminate internal moisture from materials, ensuring reliable encapsulation performance and eliminating potential quality risks

Phosphor Dispensing

Customized phosphor dispensing technology provides precise regulation of color coordinates and color rendering performance to meet diverse application requirements

Sorting

Fully automated sorting and binning achieves stringent color consistency control at 2-step SDCM – the industry's highest standard

Retest / Full Inspection

100% full inspection and retesting is implemented to strictly eliminate defective products, ensuring consistent and uniform quality across every batch

Packaging

Anti-electrostatic and vacuum-sealed packaging safeguards the product from static and moisture damage during transportation and storage